Toshiba Memory Corporation (hereinafter Toshiba) launched the XG5 series, a new line of NVM Express (NVMe) SSDs integrating 64-layer, 3D flash memories, with a maximum capacity of 1024GB in a thin single-sided form factor. Sample shipments to OEM customers start today in limited quantities, and Toshiba will gradually increase shipments from the third calendar quarter of this year.
The new SSDs, equipped with Toshiba’s latest 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH, utilize the features of PCI EXPRESS (PCIe) Gen3 x 4 lanes and SLC cache to deliver 3000 MB/s sequential read and 2100 MB/s sequential write. They are also more efficient than Toshiba existing products and reduce standby mode power consumption by over 50%, to less than 3mW.
The SSDs will be available in three capacities, 256GB, 512GB and 1024GB, in M.2 2280 single-sided form factors. Self-encrypting drive (SED) models supporting TCG Opal Version 2.01 will also be offered, making the XG5 series highly suited to a wide range of applications including ultra-mobile PCs that prioritize performance and business applications requiring security.
The XG5 series SSDs will be exhibited at COMPUTEX TAIPEI in Taipei, Taiwan, from May 30 to June 3.
Toshiba will continue to strengthen its SSD storage solutions, utilizing cutting-edge flash memory technology to meet diverse market needs.